First-level areas：Information Technology First-level areas：Chips, Electronic Components and Equipment Source：Social Recruitment Job description ： [Job Responsibilities] Responsible for the research and development of advanced packaging technology, with a focus on. 1. Key processes of wafer level system integration technology (SoW) for high computing power; 2. Wafer level system integration technology based on 2.5D/FO and other technical solutions; 3. Hybrid bonding and heterogeneous bonding techniques; 4. 3D stacking and micro bump welding technology; 5. Hybrid bonding technology for heterogeneous integration of high-end digital chips; 6. Heterogeneous integration technology. 【 Qualifications 】 1. PhD student, majoring in microelectronics, semiconductor materials, semiconductor physical chemistry, and related fields; 2. Understand advanced wafer level packaging technology and prioritize research topics related to the aforementioned research and development directions; 3. Has strong problem-solving skills, good communication skills, and excellent teamwork spirit. Please send your CV or resume as an attachment to the following email address: mailto: rbhr@hrcenter.co.uk With the subject line formatted as: ‘Name + Position + Company Name + Location’.