First-level areas：Information Technology First-level areas：Chips, Electronic Components and Equipment Source：Social Recruitment Job description ： Job content. 1. Advanced packaging technology development. Conduct research and validation of new products and processes based on the company’s development; 2. Advanced packaging process technology and project development. Lead the development of new projects, complete project content according to project requirements, solve related process problems, and coordinate multi departmental collaboration; 3. Characterize materials and devices, analyze data to form reports, write process related technical documents, and achieve sustainable development of process technology; 4. Lead the technical team to solve product problems and develop new industry standards; Job requirements. 1. Doctoral degree, majoring in microelectronics, integrated circuits, optoelectronics, materials science, chemistry, physics and other engineering disciplines; 2. Candidates with semiconductor packaging and testing related work experience are preferred (excellent recent doctoral students are also welcome); 3. Have a solid theoretical foundation and professional knowledge, strong scientific research ability and professional dedication; 4. Candidates with experience in leading major national projects are preferred; 5. Possess good logical thinking, communication skills, innovation ability, and teamwork spirit, with a strong interest in research and development work; Please send your CV or resume as an attachment to the following email address: mailto: rbhr@hrcenter.co.uk With the subject line formatted as: ‘Name + Position + Company Name + Location’.