Chip Design Engineer-Changzhou Zonghui Xinguang Semiconductor Technology Co., Ltd

Education:Doctor
Release date:24-08-15 00.00.00
Salary:50-80K
Work experience :Unlimited experience
City:Changzhou, Jiangsu Province

City : Changzhou, Jiangsu Province

Salary : 50-80K

Categories:

First-level areas:Information Technology First-level areas:Information Technology Source:Social Recruitment Job description : Key Responsibilities. 1 Design and develop InP based transmission device, such as DFB laser, EML, tunable laser, etc, including device design and modeling, mask layout, wafer fab process flow design, packaging, etc. 2 Data analysis to build correlation between performance and designs. 3 Work closely with epitaxial engineer, fab integration engineer, product engineer, packaging/testing, and foundry for new product development. Qualifications/Requirements. 1 Understand device physics and develop physical models including optical, electrical, and thermal aspects in semiconductor lasers and modulators 2 Deep understanding in device physics, strong analytical skills. 3 Strong capability in optoelectronic device design and modeling. 4 Hands-on experience in semiconductor laser design, wafer processing, reliability and failure analysis. Hands-on design experience in DFB lasers is a plus. 5 Verbal and written communication skills in both English and Mandarin. Experience in Layout software, Matlab or other device simulation software is a plus. 6 Self-motivated, resourceful, trustworthy, and team player. 7 Ph.D. Degree in EE, optics, or physics. Fresh graduates are encouraged to apply; Salary negotiable Please send your CV or resume as an attachment to the following email address: mailto: rbhr@hrcenter.co.uk With the subject line formatted as: ‘Name + Position + Company Name + Location’.

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